| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for processing a wafer, capable of eliminating the need for a step of breaking an adhesive sheet, and surely breaking the adhesive sheet.SOLUTION: A method comprises: a modified layer forming step of forming a modified layer by irradiating a wafer 11 with a laser beam; a division step of dividing the wafer into chips by applying external force; a sheet adhering step of adhering an adhesive sheet 29 that is cured by the irradiation with ultraviolet to a rear surface, and adhering a pressure sensitive adhesive sheet T on the adhesive sheet; a pressure sensitive adhesive sheet expanding step of forming gaps between chips by expanding the pressure sensitive adhesive sheet T for the wafer 11 that is divided into chips 27 and has a rear surface with the adhesive sheet 29 and the pressure sensitive adhesive sheet T; an ultraviolet irradiating step of irradiating a surface with the ultraviolet to cure and break the adhesive sheet 29 between chips after the pressure sensitive adhesive sheet expanding step; and a pick-up step of picking up the chip 27 in which the adhesive sheet 29 is adhered to its rear surface from the place above the pressure sensitive adhesive sheet after the ultraviolet irradiating step. |
