| 摘要 |
PROBLEM TO BE SOLVED: To enable, regarding an epoxy resin composition for semiconductor encapsulation which serves as an underfill material for a flip-chip in encapsulating a semiconductor device, the reduction of voids, to achieve the improvement of reliability at the time of the reflow. SOLUTION: The epoxy resin composition contains, as the essential components, 15-70 mass% as a total amount of (A) a liquid epoxy resin and (B) a curing agent and 30-85 mass% of an inorganic filler (C) comprising a hygroscopic inorganic filler (C-2). The hygroscopic inorganic filler (C-2) is a porous silica having an average particle size of 0.1-20μm and a BET specific surface area of 100-600 m<SP>2</SP>/g and/or a crystal water-removed synthetic zeolite having an average particle size of 0.1-20μm. The liquid epoxy resin composition is suitably used for the manufacture of flip-chip semiconductor devices due to excelling in workability and void property, and it is possible to manufacture the semiconductor devices having high reliability. COPYRIGHT: (C)2008,JPO&INPIT
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