| 摘要 |
PROBLEM TO BE SOLVED: To provide a pressure-sensitive adhesive sheet for electronic component package fixation which can prevent electronic components from scattering and paste from being scraped up to the side face of the electronic component at the dicing, and with which a laser mark engraved on the surface of electronic component packages is hardly extinguished at the dicing. SOLUTION: The pressure-sensitive adhesive sheet for electronic component package fixation is formed by laminating a radiation-curable pressure-sensitive adhesive layer on a substrate film, where the radiation-curable pressure-sensitive adhesive layer comprises 100 pts.mass of an acrylic polymer and 20-200 pts.mass of a radiation-curable compound having two or more unsaturated bonds, and the storage modulus of the radiation-curable pressure-sensitive adhesive layer after radiation curing is≥1×10<SP>9</SP>dyn/cm<SP>2</SP>. COPYRIGHT: (C)2008,JPO&INPIT
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