发明名称 トレイ、プラズマ処理装置、プラズマ処理方法、およびカバー部材
摘要 PROBLEM TO BE SOLVED: To inhibit the abnormal shape of an outer peripheral portion on an upper surface of a substrate.SOLUTION: A substrate housing tray 22 is carried into a chamber 12 of a plasma processing apparatus 10, in which plasma treatment of substrates W is carried out, with the substrate W and is placed therein. The substrate housing tray 22 includes: a body part 50 which includes a first through hole 50a penetrating through the body part 50 in a thickness direction and housing the substrate W and a substrate support part 22d supporting an outer peripheral portion of a lower surface Wa of the substrate W housed in the first through hole 50a and is made of a carbon containing material 50; and a cover part 52 which includes a second through hole 52a penetrating through the cover part 52 in a thickness direction so that the substrate W passes through, is disposed above the body part 50 so that the substrate support part 22d of the body part 50 is exposed through the second through hole 52a in an upward view, and is made of a material that does not contain carbon.
申请公布号 JP6029049(B2) 申请公布日期 2016.11.24
申请号 JP20120131011 申请日期 2012.06.08
申请人 パナソニックIPマネジメント株式会社 发明人 置田 尚吾;渡邉 彰三
分类号 H01L21/3065;H01L21/673;H01L21/683 主分类号 H01L21/3065
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