| 摘要 |
A component formed of a substrate (201), semiconductor chip(s) (205), such as an optoelectronic component (200), for example a light emitting diode, electrical contact wire(s) (208), electrical contact layer(s) (204, 210), electrically conductive track(s), and a protective layer (211). The protective layer (211) is optically transparent, it has a thickness is preferably below 100 nm and it is made with the atomic layer deposition method. Embodiments of the present invention solve issues associated with multichip modules and their hermetic sealing. |
