| 摘要 |
PROBLEM TO BE SOLVED: To provide a lidded MCM IC plastic overmolded package provided with chimney type heat sinks. SOLUTION: The overmolded MCM IC package is provided with a substrate, a plurality of N-piece semiconductor IC devices attached on the substrate, a plurality of N-piece heat sinks attached on the IC device, a polymer-based overmold for forming an upper surface, a plurality of N-piece semiconductor plugs of a first polymer material selectively applied, and a lid attached by a second polymer material. COPYRIGHT: (C)2008,JPO&INPIT
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