| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of analyzing a failure in a semiconductor integrated circuit device, more quickly and correctly. SOLUTION: The method of analyzing the failure in the semiconductor integrated circuit device includes storing defects and analog characteristics correlated with the defects in a database, detecting a fail bit in a first wafer, measuring analog characteristics of the fail bit in the first wafer, and identifying which defect has caused the fail bit by comparing the measured analog characteristics with the stored analog characteristics. COPYRIGHT: (C)2008,JPO&INPIT |
