| 摘要 |
PROBLEM TO BE SOLVED: To provide a light emitting module which allows an electrode of an LED die and an electrode on a circuit board to be simply and successfully connected without using wire bonding when the LED die is mounted on the circuit board in a face-up manner.SOLUTION: A light emitting module 10 includes an LED die 11 in which a semiconductor layer covers an upper surface of a semiconductor substrate 12 and an anode electrode 14 and a cathode electrode 15 are formed on the semiconductor layer. In the light emitting module 10, the LED die 11 is mounted on a circuit board 19 in a face-up manner and the anode electrode 14 and the cathode electrode 15 are connected to electrodes on the circuit board 19, respectively. For the connection, flexible printed circuit boards 17, 18 in each of which a wiring pattern is formed on a polyimide sheet are used.SELECTED DRAWING: Figure 2 |
