METHOD FOR PRODUCING LAMINATED SUBSTRATE HAVING INSULATING LAYER AT PORTION OF SUBSTRATE

摘要

According to the present invention, there is provided a method for manufacturing a bonded substrate that has an insulator layer in part of the bonded substrate, the method comprising: a porous layer forming step of partially forming a porous layer or forming a porous layer whose thickness partially varies on a bonding surface of the base substrate; an insulator layer forming step of performing a heat treatment to the base substrate having the porous layer formed thereon to change the porous layer into the insulator layer, and thereby forming the insulator layer whose thickness partially varies on the bonding surface of the base substrate; an insulator layer removing step of removing the insulator layer whose thickness varies by an amount corresponding to a thickness of a small-thickness portion by etching; a bonding step of bonding the bonding surface of the base substrate on which an unetched remaining insulator layer is exposed to a bond substrate; and a thin film forming step of reducing a thickness of the bonded bond substrate and thereby forming a thin film layer. As a result, the method for easily manufacturing a bonded substrate having an insulator layer in part of the substrate with use of the porous silicon technology can be provided.