Integrated Circuit Substrate and Method for Manufacturing the Same

摘要

The description discloses a method for use in manufacturing integrated circuit chips. The method comprises providing a wafer having a plurality of integrated circuits each provided in an separate active areas, and, for each active area, outside the active area, providing a code pattern that is associated with the integrated circuit. A computer-readable medium is also disclosed. Further, a manufacturing apparatus configured to receive a wafer and to remove material from the wafer so as to provide a scribe line to the wafer formed as a trench for use in separation of the wafer into dies is also disclosed. The description also discloses a wafer, an integrated circuit chip die substrate originating from a wafer of origin and carrying an integrated circuit, and an integrated circuit chip.

主权项

1. A method for use in manufacturing semiconductor chips, the method comprising:
providing a wafer having a plurality of active areas, each active area being provided in a separate die area; and for each active area, providing a code pattern outside the active area, the code pattern being associated with the die area.