Technique that Patterns Both Sides of a Thin Wafer to Fabricate Bi-Directional Devices

摘要

Methods and systems for fabricating bidirectional devices on both surfaces of a semiconductor wafer. Separation of the second handle wafer is accomplished by patterning a seal layer to form a grid before the second handle wafer is separated.

主权项

1. A method of fabricating bidirectional semiconductor devices having patterned doped regions on both surfaces thereof, comprising the actions of:
a) completing fabrication of patterned doped regions on one surface of a thin semiconductor device wafer which is already attached, at the other surface thereof, to a first handle wafer; b) forming a sacrificial layer over the patterned doped regions, and a seal layer over the sacrificial layer; c) patterning and etching the seal to thereby form grid; d) attaching a second handle wafer to the grid, and removing the first handle wafer from the device wafer; and e) sawing through the device wafer, in alignment to the grid, to thereby mechanically separate the device wafer from the second handle wafer.