摘要 |
PROBLEM TO BE SOLVED: To provide a substrate capable of reducing the warpage of a substrate due to a difference in curing timings of a resin material, and a method for manufacturing the same.SOLUTION: A method for manufacturing a substrate comprises the steps of: (i) forming a first removal part 16x on a conductive member 16 by processing the conductive member 16 from a first principal surface 16a side of the conductive member 16 while leaving a part of the first principal surface 16a; (ii) forming a first resin layer 14a to be bonded to the conductive member 16 by filling the first removal part 16x with an uncured first resin material and curing the first removal part 16x; (iii) forming a second removal part 16y on the conductive member 16 by processing the conductive member 16 from a second principal surface 16b side of the conductive member 16 while leaving a part of the second principal surface 16b; and (iv) forming a second resin layer 14b to be bonded to the conductive member 16 and the first resin layer 14a by filling the second removal part 16y with an uncured second resin material and curing the second removal part 16y. The first resin material and the second resin material are different materials. |