| 摘要 |
The invention relates to a method for fixing a miniaturized component, especially comprising a micro-optical element, to a pre-determined fixing section of a baseplate by means of a soldered joint. Said baseplate comprises an upper side and a lower side, and the component comprises a base surface. At least the fixing section of the baseplate is coated on the upper side by a metallic layer which is applied at least in the fixing section in a continuously plane manner and thus without interruptions. Solder material is applied at least to the fixing section coated with the metallic layer. In one step of the method, the component is arranged above the fixing section, the base surface of the component being positioned above the solder material in such a way that they do not touch, are vertically interspaced and form an intermediate region between each other. In another step, thermal energy is supplied, especially by means of a laser beam, in a region which is locally limited essentially to the fixing section, in order to melt the solder from the lower side of the baseplate, such that the intermediate region is filled by drop formation of the melted solder, fixing both sides.
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