| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide multimolded integrated component for an electronic device which component absorbs and eases a stress inside molded parts in a multimolding process, to prevent gap formation between the bonding side faces of electrical connection terminals and a resin, and gives a stable frictional force to contact points between the bonding faces of the connection terminals and aluminum wires to obtain energy necessary for bonding, thus ensures fine bonding properties. <P>SOLUTION: The primary molds of the electrical connection terminals expose from of the surface of the multimolded component, after a secondary molding. A stress-absorbing structure is formed on the primary molded resin of the primary mold which serves as the molded resin of a transmission path for stress caused by resin contraction that occurs, accompanying hardening of secondary molded resin. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
