| 摘要 |
<p>A wire bonding method is provided to perform a ball-less bonding process without an additional apparatus by using a tail portion protruded from a front portion of a capillary. A first bonding process is performed on a first bonding point. A second bonding process is performed on a second bonding point. The first and second bonding points are connected with each other by using a wire. The second bonding process includes a wire cutting process. A tail portion(11) is formed by the wire cutting process of the second bonding process. The tail portion is slightly protruded from a front end portion of a capillary(6).</p> |
