| 摘要 |
PROBLEM TO BE SOLVED: To achieve a satisfactory state of continuity contact between a probe and a solder bump by breaking an oxide film on surfaces except a surface to be inspected of a solder bump without damaging the surface to be measured. SOLUTION: An inspection jig includes the probe 17 for keeping one end part in contact with a solder bump 21 provided for a substrate to be inspected and the other end part in contact with an electrode part of an inspection apparatus for inspecting substrates to be inspected; and a holding means for holding the probe. In the inspection jig, the one end part of the probe has a corner part 17b, and the corner part of the probe comes into contact with a curved surface of the surface of the solder bump. COPYRIGHT: (C)2008,JPO&INPIT
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