| 摘要 |
A semiconductor device includes a first-conductivity- type SiC substrate (21), a first-conductivity-type SiC semiconductor layer (22) formed on the substrate (21), whose impurity concentration is lower than that of the substrate (21), a first electrode (23) formed on the semiconductor layer (22) and forming a Schottky junction with the semiconductor layer (22), a barrier height of the Schottky junction being 1 eV or less, plural second-conductivity-type junction barriers (26) formed to contact the first electrode (23) and each having a depth d1 from an upper surface of the semiconductor layer (22), a width w, and a space s between adjacent ones of the junction barriers (26), a second-conductivity-type edge termination region (24) formed outside the junction barriers (26) to contact the first electrode (23) and having a depth d2 from the upper surface of the semiconductor layer (22), and a second electrode (20) formed on the second surface of the substrate (21), wherein following relations are satisfied d1/d2 ‰¥ 1, s/d1 ‰¤ 0.6, and s/(w+s) ‰¤ 0.33. |
