| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an adhesive filling sheet which prevents a generation of void, attachment of an adhesive on the back of an electronic component, and a rising of the adhesive around a surrounding of the electronic component, at the same time, and also to provide an electronic device manufacturing method. <P>SOLUTION: The electronic device manufacturing method includes processes of: coating an adhesive 5 to be filled in a space portion between a mounting substrate 2 and a mounted electronic component 3 on one side of a sheet 11; contacting the one side of the sheet 11 with the back of the electronic component 3 mounted on the mounting substrate 2, and contacting the adhesive 5 with the surrounding of the electronic component 3 to fill the space portion with the adhesive 5; and after returning from a reduced pressure to an atmospheric pressure in the state where the sheet 11 is contacted to the electronic component 3, pressing a heating head onto the other side of the sheet 11 to heat the electronic component 3 through the sheet 11 by the heating head and hardens the adhesive 5. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
