发明名称 PAD FOR THERMOCOMPRESSION BONDING AND METHOD FOR THERMOCOMPRESSION BONDING COVER LAYER TO PRINTED CIRCUIT BOARD
摘要 A heat constriction pad and a method for thermo-compressing the cover layer are provided, which enable to reuse the pad since the polymer thin film is not fused by the heat. A pad(100) for the thermo-compression bonding comprises: a metallic foil(130); a polymer thin film(120) which is formed at the lower part of the metallic foil and is hardened; and a polymer thin film which is formed in the other surface of the metallic foil and is hardened. The metallic foil is made of the Aluminum or the SUS(Steel Use Stainless). The membranous polymer thin film is made of the silicone.
申请公布号 KR20090062590(A) 申请公布日期 2009.06.17
申请号 KR20070129938 申请日期 2007.12.13
申请人 ACT CO., LTD. 发明人 CHOI, JAE HYUN;KIM, YOUNG IN
分类号 B30B15/08;H05K3/46 主分类号 B30B15/08
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