摘要 |
PROBLEM TO BE SOLVED: To provide a light-emitting device which can achieve sufficient electrical insulation and can be manufactured in an easy manufacturing process and at low cost.SOLUTION: In an LED lamp which uses a light-emitting device as a lighting light source, the light-emitting device includes a plurality of semiconductor light-emitting elements mounted on a substrate top face and wiring patterns, in which the semiconductor light-emitting element is a semiconductor LED chip directly mounted on the substrate top face, and the wiring patterns include anode wiring patterns and cathode wiring patterns, and the plurality of semiconductor light-emitting elements are mounted among the wiring patterns. The LED lamp comprises a light-emitting part in which a plurality of rows of the semiconductor light-emitting elements and the wiring patterns are encapsulated by one encapsulation body on the substrate top face, in which the substrate includes a region which surrounds an entire periphery of the light-emitting part and which is not encapsulated by the encapsulation body on the substrate top face. |