发明名称 LEDランプ
摘要 PROBLEM TO BE SOLVED: To provide a light-emitting device which can achieve sufficient electrical insulation and can be manufactured in an easy manufacturing process and at low cost.SOLUTION: In an LED lamp which uses a light-emitting device as a lighting light source, the light-emitting device includes a plurality of semiconductor light-emitting elements mounted on a substrate top face and wiring patterns, in which the semiconductor light-emitting element is a semiconductor LED chip directly mounted on the substrate top face, and the wiring patterns include anode wiring patterns and cathode wiring patterns, and the plurality of semiconductor light-emitting elements are mounted among the wiring patterns. The LED lamp comprises a light-emitting part in which a plurality of rows of the semiconductor light-emitting elements and the wiring patterns are encapsulated by one encapsulation body on the substrate top face, in which the substrate includes a region which surrounds an entire periphery of the light-emitting part and which is not encapsulated by the encapsulation body on the substrate top face.
申请公布号 JP5980860(B2) 申请公布日期 2016.08.31
申请号 JP20140175806 申请日期 2014.08.29
申请人 シャープ株式会社 发明人 小西 正宏;英賀谷 誠;幡 俊雄
分类号 H01L33/62;F21S2/00;F21V19/00;F21V23/00;H01L33/54 主分类号 H01L33/62
代理机构 代理人
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