发明名称 Pb-FREE In-BASED SOLDER ALLOY
摘要 PROBLEM TO BE SOLVED: To provide a solder alloy where storing property is good since the secular changes of various characteristics are small, additionally the variation of quality is small and wet spreadability, bondability and the like are excellent.SOLUTION: A Pb-free solder alloy contains one or more kinds among Mg, Mn, Ni and Sb. The content of Mg when being contained is 0.01 mass% or more and 1.10 mass% or less, the content of Mn when being contained is 0.01 mass% or more and 1.00 mass% or less, the content of Ni when being contained is 0.01 mass% or more and 2.00 mass% or less, the content of Sb when being contained is 0.01 mass% or more and 19.00 mass% or less and the balance is In except inevitable impurities. In the color of the surface of the solder alloy represented by L*a*b* display system, L* is 77.0 or more and 99.8 or less, a* is -12.0 or more and 10.0 or less and b* is -10.0 or more and 11.0 or less.SELECTED DRAWING: None
申请公布号 JP2016165752(A) 申请公布日期 2016.09.15
申请号 JP20150047752 申请日期 2015.03.10
申请人 SUMITOMO METAL MINING CO LTD 发明人 IZEKI TAKASHI
分类号 B23K35/26;C22C28/00;H05K3/34 主分类号 B23K35/26
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