LEAD-FREE SOLDER ALLOY WITH LOW MELTING POINT

摘要

A lead-free solder alloy comprising: from 20 to 35 wt.% bismuth, from 0.01 to 10 wt. % copper, one or more of: from 0.001 to 4 wt.% antimony, from 0.001 to wt.% cobalt, from 0.001 to 1 wt.% germanium, from 0.001 to 1 wt.% manganese, from 0.001 to 1 wt.% nickel, from 0.001 to 1 wt.% titanium, optionally one or more of: up to 3 wt.% indium, up to 10 wt.% silver, up to 3 wt.% gallium, up to 1 wt.% gold, up to 1 wt.% chromium, up to 1 wt.% phosphorus, up to 1 wt.% zinc, up to 1 10 wt.% iron, up to 1 wt.% aluminium, up to 1 wt.% tellurium, up to 1 wt.% selenium, up to 1 wt.% calcium, up to 1 wt.% vanadium, up to 1 wt.% molybdenum, up to wt.% platinum, up to 1 wt.% magnesium, up to 1 wt.% rare earth elements, the balance Sn and any unavoidable impurities.