| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method of a circuit board, having metal wiring that is highly conductive and has high adhesion properties to a substrate. SOLUTION: The manufacturing method of the circuit board includes a process 1 for coating an insulating substrate with the solution of a non-thermoplastic polyimide-based resin precursor, converting one portion of the precursor to a non-thermoplastic polyimide-based resin by performing heat treatment for a solution removal/dehydrating condensation reaction, and forming a layer comprising the non-thermoplastic polyimide-based resin and non-thermoplastic polyimide-based resin precursor on the insulating substrate; and a process 2 for giving a dispersing element containing metal wiring formation precursor fine particles that are fused each other by heating while a primary particle diameter is 200 nm or smaller onto the layer in a circuit shape, performing heat treatment for converting the remaining precursor to the non-thermoplastic polyimide-based resin, and forming a circuit by metal wiring on a layer comprising the non-thermoplastic polyimide-based resin. COPYRIGHT: (C)2006,JPO&NCIPI |
