| 摘要 |
PROBLEM TO BE SOLVED: To enable plasma processing to be performed even to a substrate having a protruding portion on the lower surface side.SOLUTION: A plasma processing device performs plasma processing to a surface of a substrate 4 housed in a processing chamber. The plasma processing device includes: an electrode part 9 which is disposed at a bottom surface portion of a processing chamber 3, the electrode part 9 where an upper surface portion is formed by a placement part; and a support part including a lower surface part and side edge parts, which respectively guide lower surfaces and side edges of both side parts of the substrate 4, and forming a clearance between an upper surface of the placement part and the lower surface of the substrate 4. |
