| 摘要 |
PROBLEM TO BE SOLVED: To provide a cleansing method for improving a cleansing step which tends to induce a pattern collapse in a method for manufacturing a wafer having a convexo-concave pattern on its surface.SOLUTION: A method for cleansing a wafer having a convexo-concave pattern on its surface comprises at least the steps of: cleansing the wafer with cleansing solvent; substituting the cleansing solvent held in a concave portion of the wafer after the cleansing with a water-repellent chemical solution; and drying the wafer. The cleansing solvent includes 80 mass% of a solvent having a boiling point of 55-200°C. In the method, the temperature of the water-repellent chemical solution supplied in the substituting step is made 40°C to a boiling point of the water-repellent chemical solution (exclusive of the boiling point), whereby at least the surface of the concave portion is made water-repellent.SELECTED DRAWING: Figure 4 |
