| 摘要 |
This copper alloy for an electronic/electric device includes Mg at an amount of 3.3 atom% to 6.9 atom% with a remainder substantially being Cu and inevitable impurities, wherein a strength ratio TS TD /TS LD is more than 1.02, and the strength ratio TS- TD /TS LD is calculated from a strength TS TD measured by a tensile test carried out in a direction perpendicular to a rolling direction and a strength TS LD measured by a tensile test carried out in a direction parallel to the rolling direction. |
