发明名称 HEAT SINK AND AIR CONDITIONING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a heat sink having a simple structure that can efficiently radiate heat, and to provide an air conditioning device with the heat sink.SOLUTION: The heat sink includes: a substrate thermally connected to a base plate; and multiple fins of which proximal parts are coupled to the substrate and which erect from the substrate. Adjacent fins of the multiple fins are thermally coupled to each other at the tip part and the intermediate part of the fins so that a surface of the heat sink on a side of the tips of the fins is substantially flat, and a propeller of a blower is disposed at least on an extended line of the surface of the heat sink.SELECTED DRAWING: Figure 6
申请公布号 JP2016166734(A) 申请公布日期 2016.09.15
申请号 JP20160104077 申请日期 2016.05.25
申请人 PANASONIC IP MANAGEMENT CORP 发明人 NAGATOMI YOSHINARI
分类号 F24F1/24;H01L23/36;H05K7/20 主分类号 F24F1/24
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