ELECTRODE PASTE COMPOSITION FOR CHIP COMPONENT

摘要

The present invention relates to an electrode paste composition for a chip component which can: minimize delamination of a sheet and an electrode in a manner wherein a conductive filler consists of a core of metallic powder and a coating layer of ceramic powder which coats the external surface of the core, whereby the sheet and the coating layer are sintered at a similar point of time at the time of calcination so that the starting point and end point of contraction of the sheet and the coating layer proceed at a similar point of time, and the contraction behaviors of the sheet and the ceramic coating powder proceed in a similar manner to increase contraction match; be simply manufactured in a single process in a manner wherein the external surface of the core (metallic powder) of the conductive filler is coated with the (ceramic) coating layer through a spray pyrolysis process, whereby it is possible to finely control the core of the conductive filler and the coating layer by means of spray solution composition control, the specific gravity of organics, and reactor temperature control, and the process is not separated into multiple steps; and significantly increase sintering efficiency in a manner wherein the electrode paste composition for a chip component comprises glass frit and promotes sintering of the ceramic by adjusting the components and softening point of the glass frit, whereby the starting and end points of the contraction of the core and the coating layer proceed at a similar point of time.