发明名称 |
Wave soldering apparatus and nozzle thereof |
摘要 |
An apparatus used for wave soldering including a nozzle device configured to discharge molten solder to a circuit board near a solder tank, wherein, the nozzle device includes at least one pair of adjacent nozzle openings configured to discharge the molten solder towards the middle between the pair of nozzle openings. |
申请公布号 |
US9527151(B2) |
申请公布日期 |
2016.12.27 |
申请号 |
US201414315834 |
申请日期 |
2014.06.26 |
申请人 |
LENOVO ENTERPRISE SOLUTIONS (SINGAPORE) PTE. LTD. |
发明人 |
Ling Li;Pu Ke;Wang Chun C;Zhang Wei Feng |
分类号 |
B23K3/06;B23K3/08 |
主分类号 |
B23K3/06 |
代理机构 |
Roberts Mlotkowski Safran, Cole & Calderon, P.C. |
代理人 |
Robinson Douglas;Calderon Andrew M.;Roberts Mlotkowski Safran, Cole & Calderon, P.C. |
主权项 |
1. An apparatus used for wave soldering, comprising:
a nozzle device configured to discharge molten solder to a circuit board near a solder tank, wherein the nozzle device comprises at least one pair of adjacent nozzle openings configured to discharge the molten solder towards the middle between the pair of nozzle openings, and a pump device comprising a connecting pipe disposed inclinedly on an opening on a side of the solder tank, with a rotation shaft inserted into the connecting pipe through a hole in an end of the connecting pipe, the connecting pipe being enclosed, wherein each nozzle opening of the pair of nozzle openings is formed by a vertical plate and an inclined plate, the vertical plate of each nozzle opening is at the inner side of the pair of nozzle openings, and the inclined plate of each nozzle opening is at the outer side of the pair of nozzle openings, and wherein the inclination of the inclined plate of each nozzle opening is adjustable between 0 and 90 degrees. |
地址 |
Singapore SG |