发明名称 Manufacturing micromechanical component, involves providing sensor structure with trenches of width not greater than determined maximum width closable by closure layer bulges
摘要 The method involves applying a first functional layer on a substrate and forming a sensor structure, providing and structuring a first closure layer and a second functional layer, making the sensor structure movable and providing a second closure layer. The maximum trench width is determined that can be closed by first closure layer bulges that do not reach the trench floor. Sensor structure trenches are provided no wider than the maximum width. The method involves applying a first micromechanical functional layer (5) on a substrate (1), structuring the layer to have a sensor structure (6) to be made movable, providing and structuring a first closure layer (8), providing and structuring a second micromechanical functional layer (10) with at least a covering function and at least partly anchored in the first layer, making the sensor structure movable and providing a second closure layer. The maximum trench width is determined that can be closed by the first closure layer in the form of bulges (8) that do not reach the trench floor and providing the sensor structure with trenches (7) whose width is not greater than the determined maximum width. Independent claims are also included for the following: a micromechanical component.
申请公布号 DE10024697(A1) 申请公布日期 2001.11.22
申请号 DE2000124697 申请日期 2000.05.18
申请人 ROBERT BOSCH GMBH 发明人 LUTZ, MARKUS
分类号 B81C1/00;B81B3/00;B81B7/00;G01P1/02;G01P15/08;G01P15/125;(IPC1-7):B81C1/00;G01P15/12 主分类号 B81C1/00
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