CHIP EMBEDDED PCB AND METHOD OF THE SAME

摘要

A chip embedded PCB and a method for manufacturing the same are provided to reduce manufacturing cost and time by embedding a chip without a laser process. A method for manufacturing a chip embedded PCB includes the steps of: spreading conductive material around via holes of a first substrate(100); attaching a chip at the conductive material spread part(110); stacking a second substrate punched with a penetrating hole on the first substrate to insert the chip into the penetrating hole(120); and covering the chip by stacking a third substrate on the second substrate(130).