发明名称 |
Electrochemical processing apparatus and method of processing a semiconductor device |
摘要 |
An electrochemical processing apparatus is provided, in which a substrate and an anode placed in a chamber are partitioned into a cathode region including the substrate and an anode region including the anode by placing a multi-layered structure of a filtration film and a cation exchange film so that the filtration film is positioned on the substrate side. A plating solution containing additives is introduced into the cathode region, whereby a substrate is plated.
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申请公布号 |
US2008029402(A1) |
申请公布日期 |
2008.02.07 |
申请号 |
US20070882177 |
申请日期 |
2007.07.31 |
申请人 |
NEC ELECTRONICS CORPORATION |
发明人 |
KUROKAWA TETSUYA;ARITA KOJI;NODA KAORI |
分类号 |
C25D7/12;C25D17/00 |
主分类号 |
C25D7/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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