发明名称 PROCESS FOR PLATING A PIEZOELECTRIC COMPOSITE
摘要 <p>A method of manufacturing a piezo-composite element comprising a ceramic element (12) embedded in a polymer (14) such as epoxy for use in an ultrasonic transducer (10) includes first grinding the face of the composite and removing damaged ceramic (12) by acid etching the ceramic (12). The epoxy is then removed by plasma etching so that the ceramic (12) is slightly elevated above the epoxy. The composite is sputter plated so that a maximum temperature that could damage the p1a ting is not exceeded. The ceramic (12) is then poled so that a maximum temperate re that could damage the plating is not exceeded. Contacts (16) are then attached to the plating adjacent the ceramic (12). In an array, the ceramic elements (1 2) may be in the form of posts. The plurality of ceramic elements (12) is in staggered arrangement with the polymer (14).</p>
申请公布号 EP1846176(B1) 申请公布日期 2008.09.10
申请号 EP20050712606 申请日期 2005.02.03
申请人 GE INSPECTION TECHNOLOGIES, LP 发明人 YETTER, KELLY, E.;NYE, LESLIE, B.
分类号 B06B1/06;H01L41/22 主分类号 B06B1/06
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