| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device with a laminated lead frame of excellent characteristics and its manufacturing method. SOLUTION: An upper-layer lead frame with a convex on an upper terminal lower surface and a lower-layer lead frame with a concave in a lower terminal upper surface are superposed and pressurized to insert the convex into the concave to fit together the upper and lower terminals. After fitting, an electrode is abutted on the upper terminal and an earth-side electrode is grounded to the lower terminal to conduct current under slight pressure to fusion-bond fit parts by resistance welding. COPYRIGHT: (C)2009,JPO&INPIT
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