| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device capable of achieving further downsizing.SOLUTION: A semiconductor device 1 comprises: a semiconductor element 20 having a first member 21, a second member 25 and a semiconductor chip 31 arranged between the first member 21 and the second member 25; and a substrate 10 provided with a hole 15 in an insulation member in which a wiring pattern 13 is formed. The semiconductor element 20 is fitted in the hole 15 of the substrate 10 and the semiconductor chip 31 included in the semiconductor element 20 and the wiring pattern 13 formed in the substrate 10 are electrically connected. |
