| 摘要 |
SOLUTION: A method for integrating such elements as isolated dies or a wafer three-dimensionally, and an integrated structure where such elements as isolated dies or a wafer is connected. One or both of the die or wafer has a semiconductor device formed therein. A first element having a first contact structure is bonded to a second element having a second contact structure. The first and second contact structures can be exposed at the time of bonding, and are connected electrically as a result of bonding. After bonding, a via is etched and embedded to expose and form electric wiring for connecting the first and second contact structures, thus allowing electrical access to the electric wiring from the surface. Alternatively, the first and second contact structures are not exposed at the time of bonding, but a via is etched and embedded after bonding thus connecting the first and second contact structures electrically, and electrical access to the first and second contact structures is obtained.SELECTED DRAWING: Figure 20E |
