| 发明名称 |
ASSEMBLY AND METHOD FOR TRANSFER MOLDING |
| 摘要 |
One exemplary embodiment of this disclosure relates to a transfer molding assembly including a chamber, a die within the chamber, a first gas control device configured to provide a first gas into the chamber, and a second gas control device configured to provide a second gas into the die. |
| 申请公布号 |
US2016250660(A1) |
申请公布日期 |
2016.09.01 |
| 申请号 |
US201415029312 |
申请日期 |
2014.10.14 |
| 申请人 |
UNITED TECHNOLOGIES CORPORATION |
发明人 |
JARMON David C. |
| 分类号 |
B05D1/00;B05C1/00 |
主分类号 |
B05D1/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A transfer molding assembly, comprising:
a chamber; a die within the chamber; a first gas control device configured to provide a first gas into the chamber; and a second gas control device configured to provide a second gas into the die. |
| 地址 |
Hartford CT US |
