| 摘要 |
This disclosure relates to a wiring substrate and a manufacturing method allowing for simultaneous solution to the problems of stress and heat dissipation in a wiring substrate in which a glass substrate is used as a core material and that has via electrodes. A wiring substrate as one aspect of this disclosure is provided with a glass substrate as a core material and a plurality of through-holes arranged in the glass substrate at regular intervals, and the through-holes are filled with filling materials of different types. A manufacturing method as one aspect of this disclosure is a method for manufacturing a wiring substrate, including: a through-hole formation step for forming a plurality of through-holes arranged at regular intervals in a glass substrate as a core material; and a filling step for forming, on the glass substrate, a protection sheet in which only through-holes for loading filling materials are open for each type of the filling materials with which the through-holes are to be filled, and for loading the filling materials through the openings in the protection sheet. This disclosure is applicable to a wiring substrate in which a glass substrate having via electrodes is a core material. |
