发明名称 半導体発光装置および半導体発光装置の製造方法
摘要 PROBLEM TO BE SOLVED: To provide a semiconductor light-emitting device equipped with a light-emitting element and an electrode pad on a substrate and a manufacturing method of the same, which can improve light extraction efficiency and reduce luminance unevenness in a light extraction surface.SOLUTION: A semiconductor light-emitting device 1 comprises: a substrate 10 including a recess 121 provided on an element mounting surface and electrode pads 32n, 32p provided at a bottom face of the recess; at least one light-emitting element(s) 20a, 20b, 20c, 20d, 20e, 20f provided on the element mounting surface of the substrate and electrically connected with the electrode pads; and a light reflective resin 50 buried in the recess so as to cover the electrode pads. The light reflective resin has a crest forwarder than a surface of the light-emitting element in a light projecting direction and a surface from the crest toward a sidewall of the recess has a concave face.
申请公布号 JP5720995(B2) 申请公布日期 2015.05.20
申请号 JP20110062317 申请日期 2011.03.22
申请人 スタンレー電気株式会社 发明人 重枝 裕司
分类号 H01L33/48;H01L21/56;H01L23/29;H01L23/31 主分类号 H01L33/48
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