发明名称 FORMING OF PACKAGE
摘要 PROBLEM TO BE SOLVED: To have an excellent appearance and improve flatness, by shifting a cutting flaw formed on the outer surface of a package to the inside of a recess part. SOLUTION: This forming method is a forming method of a package for arranging electronic parts and a wiring board on a metal plate. Concerning a package 1, a recess part is press-formed by a press or the like from the one surface side of a metal plate having a prescribed plate thickness, and a metal of the recess part is shifted to the other surface side of the metal plate, thereby projectingly forms a projection part. After cutting the projection part by cutting, a bottom plate of the recess part is shifted to the one surface side by pressing by a press or the like from the other surface side corresponding to the recess part, thereby forms a recess part 2 on the other surface of the metal plate.
申请公布号 JP2000042819(A) 申请公布日期 2000.02.15
申请号 JP19980226477 申请日期 1998.07.27
申请人 NAKAMURA SEISAKUSHO KK 发明人 MIYAHARA HIDEYUKI
分类号 B23C3/00;B21D28/10;H01L23/12;H01L23/36;(IPC1-7):B23C3/00 主分类号 B23C3/00
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