METHOD OF ETCHING SURFACE OF WAFER,申请号KR20050102485-传众专利搜索

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发明名称	METHOD OF ETCHING SURFACE OF WAFER
摘要
申请公布号	KR20070045795(A)	申请公布日期	2007.05.02
申请号	KR20050102485	申请日期	2005.10.28
申请人	SILTRON INC.	发明人	LEE, JAE CHOON;LEE, SANG HYUN;LEE, SANG HEE;HONG, JIN KYUN
分类号	H01L21/304	主分类号	H01L21/304
代理机构		代理人
主权项
地址

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