发明名称 POLISHING COMPOSITION AND METHOD THEREFOR
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a polishing composition suitable for use in an application of polishing an object to be polished made of silicon dioxide, and to provide a polishing method using such a polishing composition. <P>SOLUTION: The polishing composition contains silica abrasive grains of the average particle diameter of 20 to 100 nm; alkali selected from ammonia, ammonium salt, alkali metal salt, and alkali metal hydroxide; and silicone oil with≥8 HLB value. <P>COPYRIGHT: (C)2007,JPO&INPIT</p>
申请公布号 JP2007103514(A) 申请公布日期 2007.04.19
申请号 JP20050289169 申请日期 2005.09.30
申请人 FUJIMI INC 发明人 ITO TAKASHI;KIMURA YOSHIHISA
分类号 H01L21/304;B24B37/00;B82Y10/00 主分类号 H01L21/304
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