发明名称 COMPONENT MOUNTING BOARD, AND MANUFACTURING METHOD THEREOF
摘要 PROBLEM TO BE SOLVED: To provide a component mounting board and a manufacturing method thereof, preventing the edge and side face of an electronic component from being brought into contact with the wiring layer of a wiring board. SOLUTION: This component mounting board 10 is equipped with the wiring board 11 having the wiring layer 15, an electronic component 12 mounted to at least one face 11a side of the wiring board 11, and a holding member 13 having a recessed part 17 to house the electronic component 12. The recessed part 17 has a shape almost equal to the outline of the electronic component 12, the electronic component 12 is housed in the recessed part 17 so that its one face 12a where its terminal 16 is provided and the open end 17a of the recessed part 17 are disposed on the almost same surface, and the terminal 16 is connected to the wiring layer 15 through NCP 18. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009049059(A) 申请公布日期 2009.03.05
申请号 JP20070211364 申请日期 2007.08.14
申请人 TOPPAN FORMS CO LTD 发明人 NAKAYAMA MACHIKO;TAKAHASHI HIRONARI;OTA YORIKO
分类号 H05K1/18;H05K3/32 主分类号 H05K1/18
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