| 摘要 |
The disclosure relates to a package comprising of a heat seal between two films. The first film contains at least 70% by weight of polyamides and a modifying layer. The modifying layer contains 70% by weight of polyamides and one or more of ethylene/alkyl (meth)acrylate copolymers, ethylene/(meth)acrylic acid copolymers and ionomers. The second film contains at least 70% by weight one or more polyamides. The package is designed to be used under high temperatures, such as in an oven. The package is suitable for ready to eat, or heat and eat, food products. |
