FUSION BONDED LIQUID CRYSTAL POLYMER ELECTRICAL CIRCUIT STRUCTURE

摘要

A method of making a fusion bonded circuit structure. A substrate is provided with a seed layer of a conductive material. A first resist layer is deposited on the seed layer. The first resist layer is processed to create first recesses corresponding to a desired first circuitry layer. The first recesses expose, portions of the seed layer of conductive material. The substrate is electroplated to create first conductive traces defined by the first recesses. The first resist layer is removed to reveal the first conductive traces. The substrate is etched to remove exposed portions of the seed layer adjacent the first conductive traces. A portion of the seed layer is interposed between the first conductive traces and the substrate. A first layer of LCP is fusion boned to the first major surface of the substrate to encapsulate the first conductive traces in an LCP material. The first LCP layer can be laser drilled to expose the conductive traces.

主权项

1. A method of making a fusion bonded circuit structure comprising the step of:
providing a first substrate with a first major surface having a seed layer of a conductive material; depositing a first resist layer on the seed layer of conductive material; processing the first resist layer to create a plurality of first recesses corresponding to a desired first circuitry layer, the first recesses exposing portions of the seed layer of conductive material; electroplating the first substrate to create first conductive traces defined by the first recesses, wherein the seed layer of conductive material acts as an electrical bus for the, electroplating process; removing the first resist layer to reveal the first conductive traces; etching the first substrate to remove exposed portions of the seed layer of conductive material adjacent the first conductive traces, wherein an unetched portion of the seed layer of conductive material remains between the first conductive traces and the first substrate; and fusion bonding a first LCP layer to the first major surface of the first substrate to encapsulate the first conductive traces in an LCP material.