| 摘要 |
PROBLEM TO BE SOLVED: To improve reliability of a semiconductor device by preventing an adhesive from flowing into an interface between a semiconductor element and a cover member.SOLUTION: A semiconductor device comprises: a substrate mounted with a semiconductor element on a surface thereof; an adhesive arranged around a region in which the semiconductor element is mounted on the surface of the substrate and including an extention part extending along a side of the semiconductor element; and a cover member including a first surface arranged to cover the semiconductor element and in contact with the adhesive, and a protrusion provided at a position corresponding to a tip part of the extension part on the first surface. |
