EPOXY MOLDING COMPOUND FOR HIGH POWER SOIC SEMICONDUCTOR PACKAGE APPLICATION

摘要

An epoxy molding compound and a preparation process and use of the epoxy molding compound are provided. The epoxy molding compound comprises an epoxy resin, a phenolic resin, a low stress modifier, an ion trapping agent, a curing accelerator and a filler. The epoxy molding compound can be used on high power SOIC semiconductor package with electrical leakage less than 30 μA at 180℃, meanwhile it can pass JEDEC standards for reliability and lead-free reflow requirements at 260℃.