| 发明名称 |
FAN-OUT PACKAGE STRUCTURE INCLUDING ANTENNA |
| 摘要 |
A semiconductor package structure including a first semiconductor package is provided. The first semiconductor package includes a first semiconductor package including a first redistribution layer (RDL) structure having a first surface and a second surface opposite thereto. A first semiconductor die and a first molding compound that surrounds the first semiconductor die are disposed on the first surface of the first RDL structure. An IMD structure having a conductive layer with an antenna pattern or a conductive shielding layer is disposed on the first molding compound and the first semiconductor die. |
| 申请公布号 |
US2016329299(A1) |
申请公布日期 |
2016.11.10 |
| 申请号 |
US201615130994 |
申请日期 |
2016.04.17 |
| 申请人 |
MediaTek Inc. |
发明人 |
LIN Tzu-Hung;PENG I-Hsuan;LIU Nai-Wei;HSIAO Ching-Wen;HUANG Wei-Che |
| 分类号 |
H01L25/065;H01L23/522;H01L23/66;H01L23/31 |
主分类号 |
H01L25/065 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A semiconductor package structure, comprising:
a first semiconductor package, comprising:
a first redistribution layer (RDL) structure having a first surface and a second surface opposite thereto;a first semiconductor die disposed on the first surface of the first RDL structure;a first molding compound disposed on the first surface of the first RDL structure and surrounding the first semiconductor die; andan inter-metal dielectric (IMD) structure disposed on the first molding compound and the first semiconductor die, wherein the IMD structure has a conductive layer with an antenna pattern electrically coupled to the first RDL structure. |
| 地址 |
Hsin-Chu TW |
