| 摘要 |
Provided is a solder supply method of supplying, onto a mask sheet (100), solder to be printed on a printed circuit board (U). The method includes calculating an amount of solder supplied for a plurality of points in an X direction that is a lengthwise direction of a squeegee (50), and changing the amount of solder supplied at each point in the X direction based on a result of the calculation. |
