发明名称 |
LAMINATE TYPE ELECTRONIC COMPONENT, METHOD FOR MANUFACTURING THE SAME AND MOUNTING SUBSTRATE THEREFOR |
摘要 |
PROBLEM TO BE SOLVED: To provide: a laminate type electronic component which is superior in DC superposition characteristic and improved in magnetic material material's loss characteristic, and of which the efficiency is increased by reducing a DC resistance; a method for manufacturing such an electronic component; and a mounting substrate therefor.SOLUTION: A laminate type electronic component comprises: metal magnetic material layers 10; and an internal conductor formation layer 20 formed over the metal magnetic material layers 10. The internal conductor formation layer 20 includes: an internal inductance pattern part 21; and a negative print part 22. In a cross section of the negative print part 22, to the total number of particles, the particles having a length of 5 μm or less in the long axis direction thereof account for 65%-70%, and the particles having a length of 10-20 μm account for 8-12%. |
申请公布号 |
JP2015106709(A) |
申请公布日期 |
2015.06.08 |
申请号 |
JP20140117344 |
申请日期 |
2014.06.06 |
申请人 |
SAMSUNG ELECTRO-MECHANICS CO LTD |
发明人 |
KIM IC SEOB;SON SOO HWAN;CHOI YU JIN;KIM HO YOON;KIM MYEONG GI;SONG SO YEON;CHEON MIN KYOUNG;MOON BYEONG CHEOL;YI YON-IL |
分类号 |
H01F17/04;H01F1/20;H01F17/00;H01F27/06;H01F41/04 |
主分类号 |
H01F17/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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