发明名称 LAMINATE TYPE ELECTRONIC COMPONENT, METHOD FOR MANUFACTURING THE SAME AND MOUNTING SUBSTRATE THEREFOR
摘要 PROBLEM TO BE SOLVED: To provide: a laminate type electronic component which is superior in DC superposition characteristic and improved in magnetic material material's loss characteristic, and of which the efficiency is increased by reducing a DC resistance; a method for manufacturing such an electronic component; and a mounting substrate therefor.SOLUTION: A laminate type electronic component comprises: metal magnetic material layers 10; and an internal conductor formation layer 20 formed over the metal magnetic material layers 10. The internal conductor formation layer 20 includes: an internal inductance pattern part 21; and a negative print part 22. In a cross section of the negative print part 22, to the total number of particles, the particles having a length of 5 μm or less in the long axis direction thereof account for 65%-70%, and the particles having a length of 10-20 μm account for 8-12%.
申请公布号 JP2015106709(A) 申请公布日期 2015.06.08
申请号 JP20140117344 申请日期 2014.06.06
申请人 SAMSUNG ELECTRO-MECHANICS CO LTD 发明人 KIM IC SEOB;SON SOO HWAN;CHOI YU JIN;KIM HO YOON;KIM MYEONG GI;SONG SO YEON;CHEON MIN KYOUNG;MOON BYEONG CHEOL;YI YON-IL
分类号 H01F17/04;H01F1/20;H01F17/00;H01F27/06;H01F41/04 主分类号 H01F17/04
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